Memory array, semiconductor chip and manufacturing method of memory array

ABSTRACT

A memory array, a semiconductor chip and a method for forming the memory array are provided. The memory array includes first signal lines, second signal lines and memory cells. The first signal lines extend along a first direction. The second signal lines extend along a second direction over the first signal lines. The memory cells are defined at intersections of the first and second signal lines, and respectively include a resistance variable layer, a switching layer, an electrode layer and a carbon containing dielectric layer. The switching layer is overlapped with the resistance variable layer. The electrode layer lies between the resistance variable layer and the switching layer. The carbon containing layer laterally surrounds a stacking structure including the resistance variable layer, the switching layer and the electrode layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of U.S. provisionalapplication Ser. No. 63/188,455, filed on May 14, 2021. The entirety ofthe above-mentioned patent application is hereby incorporated byreference herein and made a part of this specification.

BACKGROUND

With advances in digital technology, there is a greater demand for anonvolatile memory device with higher capacity, less writing power,higher writing/reading speed, and longer service life. In order to meetthe demand, refinement of a flash memory has been progressed. On theother hand, a nonvolatile memory device including memory cells eachhaving a resistance variable element has been researched and developed.

Mostly, each of these nonvolatile memories has field effect transistors(FETs) that connect and disconnect the resistance variable elements froma driving circuit. The FETs have high on/off ratio and prevent leakagecurrent from passing through the unselected memory cells. However, sincea FET is a three-terminal device, such configuration of controllingaccess of the resistance variable elements by the FETs can significantlylimit design flexibility and integration level in creating thesenonvolatile memories.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1A is a schematic three-dimensional view illustrating a memoryarray, according to some embodiments of the present disclosure.

FIG. 1B is a circuit diagram illustrating an equivalent circuit of thememory array as shown in FIG. 1A.

FIG. 2A is a schematic cross-sectional view of a memory cell definedbetween a first signal line and a second signal line, according to someembodiments of the present disclosure.

FIG. 2B is a schematic top view of a pillar structure as shown in FIG.2A.

FIG. 3A is a schematic cross-sectional view of a semiconductor chipincluding a memory array along a word line, according to someembodiments of the present disclosure.

FIG. 3B is a schematic cross-sectional view of the semiconductor chipalong a bit line of the memory array in the semiconductor chip,according to some embodiments of the present disclosure.

FIG. 4 is a flow diagram illustrating a method for forming a memoryarray during manufacturing process of a semiconductor chip, according tosome embodiments of the present disclosure.

FIG. 5A through FIG. 5L are schematic three-dimensional viewsillustrating intermediate structures at various stages during formationof the memory array as shown in FIG. 4.

FIG. 6A is a schematic three-dimensional view illustrating a memoryarray, according to some embodiments of the present disclosure.

FIG. 6B is a schematic cross-sectional view of one of the memory cellsin the memory array as shown in FIG. 6A.

FIG. 7 is a block diagram illustrating an arrangement of a memory arrayand a driving circuit lying below the memory array, according to someembodiments of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

FIG. 1A is a schematic three-dimensional view illustrating a memoryarray 10, according to some embodiments of the present disclosure.

Referring to FIG. 1A, the memory array 10 includes memory cells 100arranged along columns and rows. Each column of the memory cells 100 arearranged along a direction Y, while each row of the memory cells 100 arearranged along a direction X intersected with the direction Y. Thememory cells 100 are defined between first signal lines SL1 and secondsignal lines SL2 running over the first signal lines SL1. A bottom endof each memory cell 100 is coupled to one of the first signal lines SL1,and a top end of each memory cell 100 is coupled to one of the secondsignal lines SL2. The first signal lines SL1 may be referred as bitlines, while the second signal lines SL2 may be referred as word lines.Alternatively, the first signal lines SL1 may be referred as word lines,while the second signal lines SL2 may be referred as bit lines. In someembodiments, each memory cell 100 is positioned at an intersection (orreferred as a cross-point) of one of the first signal lines SL1 and oneof the second signal lines SL2. In these embodiments, the first signallines SL1 may extend along the direction Y, and the second signal linesSL2 may extend along the direction X. In addition, each column of thememory cells 100 may share one of the first signal lines SL1, and eachrow of the memory cells 100 may share one of the second signal linesSL2. In other words, each first signal line SL1 may be coupled to thebottom ends of a column of the memory cells 100, and each second signalline SL2 may be coupled to the top ends of a row of the memory cells100.

FIG. 1B is a circuit diagram illustrating an equivalent circuit of thememory array 10.

Referring to FIG. 1A and FIG. 1B, each memory cell 100 includes aresistance variable element 110 and a selector 120. The resistancevariable element 110 may be a two-terminal device. An electricalresistance across the resistance variable element 110 can be altered bychanging polarity of a programming electrical signal provided to theresistance variable element 110 by the corresponding first and secondsignal lines SL1, SL2. In this way, the resistance variable element 110can be programmed with a low resistance state or a high resistancestate, and a logic data “0” or a logic data “1” can be stored in theresistance variable element 110. Further, the stored data can be kepteven when the programming electrical signal is turned off, and theresistance variable element 110 can be described as a nonvolatile memoryelement. The programming electrical signal may be an input currentprovided to the resistance variable element 110, or a voltage biasapplied across the resistance variable element 110. In some embodiments,the electrical resistance of the resistance variable element 110 isaltered by formation/destruction of a conductive path (or referred as afilament) in the resistive variable element 110, and the memory array 10including the memory cells 100 each having the resistance variableelement 110 may be a resistive random access memory (RRAM). In otherembodiments, the electrical resistance of the resistance variableelement 110 is altered by changing crystallinity of a material layer inthe resistance variable element 100, and the memory array 10 includingthe memory cells 100 each having the resistance variable element 110 maybe a phase change random access memory (PCRAM).

The selector 120 coupled to the resistance variable element 110 is atwo-terminal device as well. As a result of current-voltage (IV)nonlinear characteristic of the selector 120, the selector 120 may beturned on and act like a conductor when a voltage bias across theselector 120 is greater than a threshold voltage, and may be in an offstate and act like an insulator when the voltage bias is less than thethreshold voltage. Accordingly, the resistance variable element 110 maybe coupled to the corresponding first and second signal lines SL1, SL2when the selector 120 is turned on, and may be decoupled from one of thefirst and second signal lines SL1, SL2 connected to the selector 120when the selector 120 is in an off state. In other words, the selector120 may be functioned as an access switch of the resistance variableelement 110. As examples, the selector 120 is a tunneling layer basedselector, a mixed ionic electronic conduction (MIEC) selector, a metalinsulator transition (MIT) selector, a threshold vacuum switch (TVS)selector, a volatile conductive-bridging random access memory (CBRAM)type selector, an ovonic threshold switching (OTS) selector or the like.As shown in FIG. 1B, the resistance variable element 110 and theselector 120 may be coupled together by a common terminal. For instance,the selector 120 may be disposed on the resistance variable element 110,and coupled to the resistance variable element 110 through a commonterminal shared by the selector 120 and the resistance variable element110. By controlling the selector 120, the resistance variable element110 may be coupled to or decoupled from the second signal line SL2connected to the selector 120. Alternatively, the selector 120 may bedisposed below the resistance variable element 110. In these alternativeembodiments, by controlling the selector 120, the resistance variableelement 110 may be coupled to or decoupled to the first signal line SL1connected to the selector 120.

FIG. 2A is a schematic cross-sectional view of each memory cell 100defined between the corresponding first and second signal lines SL1, SL2as shown in FIG. 1A.

Referring to FIG. 1A and FIG. 2A, the memory cell 100 defined betweenone of the first signal lines SL1 and one of the second signal lines SL2includes a pillar structure 112. The pillar structure 112 includesmultiple layers stacked along a vertical direction, and is disposedbetween the first signal line SL1 and the second signal line SL2. Thepillar structure 112 includes a resistance variable layer 114 as a datastorage layer of the resistance variable element 110, and may include anelectrode layer 116 as a common terminal of the resistance variableelement 110 and the selector 120. In some embodiments, a portion of thefirst signal line SL1 overlapped with the pillar structure 112 isfunctioned as the other terminal of the resistance variable element 110.In these embodiments, the resistance variable element 110 is defined bythe resistance variable layer 114, the electrode layer 116 and theportion of the first signal line SL1. The resistance variable layer 114may be a single layer, or includes multiple sublayers stacked along thevertical direction. In those embodiments where the memory array 10 is aRRAM, the resistance variable layer 114 may be formed of hafnium oxide(HfO_(x)), zirconium oxide (ZrO_(x)) or the like, or may include a stackof sublayers each formed of one of these materials. In those embodimentswhere the memory array 10 is a PCRAM, the resistance variable layer 114may be formed of GeTe, InSe, SbTe, GaSb, InSb, AsTe, AlTe, GeSbTe,TeGeAs, InSbTe, TeSnSe, GeSeGa, BiSeSb, GaSeTe, SnSbTe, InSbGe, TeGeSbS,TeGeSnO, TeGeSnAu, PdTeGeSn, InSeTiCo, GeSbTePd, GeSbTeCo, SbTeBiSe,AgInSbTe, GeSbSeTe, GeSnSbTe, GeTeSnNi, GeTeSnPd, GeTeSnPt, transitionmetal oxide materials, binary alloys (e.g., including transition metals,alkaline earth metals, and/or rare earth metals) or combinationsthereof. As an example, a thickness of the resistance variable layer 114may range from 5 nm to 20 nm. On the other hand, the electrode layer 116and the first signal line SL1 are respectively formed of a conductivematerial. For instance, the electrode layer 116 is formed of TiN, Ta,TaN, Ru or combinations thereof, and the first signal line SL1 may beformed of Al-Cu alloy, W, Cu, TiN, TaN, Ru, AlN, Co or combinationsthereof. In some embodiments, a thickness of the electrode layer 116ranges from 10 nm to 20 nm, while a thickness of the first signal lineSL1 ranges from 20 to 50 nm.

The pillar structure 112 further includes a switching layer 118. Theswitching layer 118 is functioned as an active layer of the selector120, and may exhibit the IV nonlinear characteristic while sweeping avoltage applied to the switching layer 118. In some embodiments, theswitching layer 118 is stacked over the electrode layer 116, which maybe functioned as the common terminal of the resistance variable element110 and the selector 120. In addition, a portion of the second signalline SL2 overlapped with the pillar structure 112 may be functioned asthe other terminal of the selector 120. In this way, the selector 120may be defined by the switching layer 118, the electrode layer 116 andthe portion of the second signal line SL2. The switching layer 118 maybe a single layer, or includes multiple sublayers stacked along thevertical direction. In some embodiments, the switching layer 118 isformed of GeTe, GeCTe, AsGeSe, GeSbTe, GeSiAsTe, GeSe, GeSbSe, GeSiAsSe,GeS, GeSbS, GeSiAsS, the like, or combinations thereof. Alternatively,the selector layer 118 may include BTe, CTe, BCTe, CSiTe, BSiTe, BCSiTe,BTeN, CTeN, BCTeN, CSiTeN, BSiTeN, BCSiTeN, BTeO, CTeO, BCTeO, CSiTeO,BSiTeO, BCSiTeO, BTeON, CTeON, BCTeON, CSiTeON, BSiTeON, BCSiTeON, thelike or combinations thereof. As an example, a thickness of theswitching layer 118 may range from 3 nm to 10 nm. On the other hand, thesecond signal line SL2 is formed of a conductive material the same ordifferent from the conductive material of the first signal line SL1. Forinstance, the second signal line SL2 may be formed of Al—Cu alloy, W,Cu, TiN, TaN, Ru, AlN, Co or combinations thereof. In some embodiments,a thickness of the second signal line SL2 ranges from 20 to 50 nm.

In some embodiments, an adhesive layer 117 is formed between theelectrode layer 116 and the switching layer 118, in order to improveadhesion between the electrode layer 116 and the switching layer 118.The adhesive layer 117 may be formed of a conductive material, and theelectrode layer 116 as well as the adhesive layer 117 may becollectively functioned as the common terminal of the resistancevariable element 110 and the selector 120. For instance, the adhesivelayer 117 may be formed of a tungsten-based material, such as tungsten,tungsten oxide, tungsten nitride or the like. In some embodiments, athickness of the adhesive layer 117 ranges from 3 to 10 nm.

The pillar structure 112 further includes a carbon containing dielectriclayer 122 defining a sidewall of the pillar structure 112. In someembodiments, the carbon containing dielectric layer 122 laterallysurrounds a stacking structure ST including the resistance variablelayer 114, the electrode layer 116 and the switching layer 118 (orfurther including the adhesive layer 117). The carbon containingdielectric layer 122 has an ultra-low dielectric constant (k), which maybe even lower than a low-k material such as fluorinated silicon glass(FSG or SiOF), phosphosilicate glass(PSG), carbon doped oxide dielectriccomprising Si, C, O and H (SiCOH), hydrogen silsesquioxane (HSQ),methyl-silsesquioxane (MSQ), polyarylene ether (PAE), polyimide,parylene N, parylene F, teflon (PTFE), fluorinated amorphous carbon(a-C:F) or the like. In some embodiments, the carbon containingdielectric layer 122 is formed of porous SiCOH. In these embodiments,the carbon containing dielectric layer 122 may be amorphous, and mayhave a dielectric constant (k) substantially equal to or greater than1.5, and less than 2, such as about 1.8. As to be further described, thecarbon containing dielectric layer 122 may be formed in an etchingapparatus. As compared to using a chemical vapor deposition (CVD)apparatus for depositing the carbon containing dielectric layer 122,using an etching apparatus for deposition of the carbon containingdielectric layer 122 may result in high porosity and low crystallinityof the carbon containing dielectric layer 122, due to low film density.Because of the high porosity and the low crystallinity, the carboncontaining dielectric layer 122 may have an ultra-low dielectricconstant. As shown in FIG. 1A and FIG. 2A, since the stacking structuresST of the memory cells 100 are each laterally surrounded by a carboncontaining dielectric layer 122 with an ultra- low dielectric constant,a parasitic capacitance between these stacking structures ST can beeffectively reduced. Accordingly, resistance-capacitance (RC) delay inthe memory array 10 can be reduced. Further, the carbon containingdielectric layer 122 may protect the stacking structures ST from damagescaused by moisture and etchants generated during manufacturing of thememory array 10. Therefore, a queue time during the manufacturing of thememory array 10 can be less limited. In some embodiments, a thickness ofthe carbon containing dielectric layer 122 ranges from about 1 nm toabout 3 nm. If the thickness of the carbon containing dielectric layer122 is less than about 1 nm, reduction of the parasitic capacitance andthe protection from the moisture and etchant damages may not beeffective. On the other hand, if the thickness of the carbon containingdielectric layer 122 is greater than about 3 nm, the carbon containingdielectric layer 122 may accidentally peel from the stacking structureST. Further, if a total footprint area of the stacking structure ST andthe carbon containing dielectric layer 122 is fixed, excessivelyincreasing the thickness of the carbon containing dielectric layer 122may result in reduction of a footprint area of the stacking structureST, which may raise contact resistance between the stacking structure STand the first and second signal lines SL1, SL2.

A boundary of the pillar structure 112 is defined by an outer sidewallof the carbon containing dielectric layer 122. In some embodiments, asshown in FIG. 2A, the boundary of the pillar structure 112 is slightlyrecessed from a boundary of the underlying first signal line SL1. Inother embodiments, the boundary of the pillar structure 112 issubstantially aligned with the boundary of the underlying first signalline SL1. In yet other embodiments, the boundary of the pillar structure112 is laterally protruded from the boundary of the underlying firstsignal line SL1.

Similarly, the boundary of the pillar structure 112 may be slightlyrecessed from a boundary of the overlying second signal line SL2, oralternatively be substantially aligned with or laterally protruded fromthe boundary of the overlying second signal line SL2.

In some embodiments, the stacking structure ST is subjected tonitridation before being covered by the carbon containing dielectriclayer 122, and a nitride layer 124 may be formed in a peripheral regionof the stacking structure ST. The nitride layer 124 may laterally extendinto the stacking structure ST from the sidewall of the stackingstructure ST, and may be laterally surrounded by the carbon containingdielectric layer 122. The nitride layer 124 can further protect thestacking structure ST (i.e., an inner portion of the stacking structureST) from the moisture and etchants damages. Since the layers in thestacking structure ST may have different susceptibilities tonitridation, a thickness of the nitride layer 124 may vary amongdifferent layers of the stacking structure ST. As an example, thethickness of the nitride layer 124 may range from about 0.1 nm to about1 nm. In other embodiments, the stacking structure ST is not subjectedto nitridation, and a nitride layer at a peripheral region of thestacking structure ST may be absent.

FIG. 2B is a schematic top view of the pillar structure 112 as shown inFIG. 2A.

Referring to FIG. 2A and FIG. 2B, in some embodiments, the pillarstructure 112 standing on the first signal line SL1 is formed in acylinder shape. In these embodiments, the carbon containing dielectriclayer 122 and the nitride layer 124 may each appear as a circular ringwhen viewing from above the pillar structure 112. However, the pillarstructure 112 may be alternatively formed in other shapes, the presentdisclosure is not limited to dimension and geometry of the pillarstructure 112. In addition, as described above, the boundary of thepillar structure 112 may be within the boundary of the first signal lineSL1, according to some embodiments. In alternative embodiments, theboundary of the pillar structure 112 may be substantially aligned withor laterally protruded from the boundary of the first signal line SL1.

FIG. 3A is a schematic cross-sectional view of a semiconductor chip 30including the memory array 10 along one of the word lines WL, accordingto some embodiments of the present disclosure. FIG. 3B is a schematiccross-sectional view of the semiconductor chip 30 including the memoryarray 10 along one of the bit lines BL, according to some embodiments ofthe present disclosure.

Referring to FIG. 3A and FIG. 3B, the memory array 10 may be formed in asemiconductor chip 30. The semiconductor chip 30 may include afront-end-of-line (FEOL) structure 300F and a back-end-of-line (BEOL)structure 300B stacked on the FEOL structure 300F. The FEOL structure300F includes a semiconductor substrate 302 and active devices 304formed at a front surface of the semiconductor substrate 302. Thesemiconductor substrate 302 may be a semiconductor wafer or asemiconductor-on-insulator (SOI) wafer. The active devices 304 may befield effect transistors (FETs), and each active device 304 may includea gate structure 306 and a pair of source/drain structures 308 atopposite sides of the gate structure 306. In some embodiments, the gatestructure 306 may be disposed on a planar portion of the semiconductorsubstrate 302, and the source/drain structures 308 may be doped regionsin the semiconductor substrate 302 or epitaxial structures formed inrecesses at the front surface of the semiconductor substrate 302. Inthese embodiments, the active devices 304 may be planar-type FETs. Inalternative embodiments, the semiconductor substrate 302 may be shapedto form fin structures or vertically spaced separatednanosheets/nanorods at the front surface, and these fin structures ornanosheets/nanorods are intersected with and covered by the gatestructures 306. In these alternative embodiments, the active devices 304may be fin-type FETs (finFETs) or gate-all-around FETs (GAA-FETs).However, the present disclosure is not limited to types of the FETs, andthe FEOL structure 300F may further include other active devices and/orpassive devices formed at the front surface of the semiconductorsubstrate 302. Moreover, the FEOL structure 300F may further includes adielectric layer 310 and contact plugs 312 formed in the dielectriclayer 310. The active devices 304 are covered by the dielectric layer310. The contact plugs 312 extend from the gate structures 306 and thesource/drain structures 308 to a top surface of the dielectric layer310.

The BEOL structure 300B may include a stack of interlayer dielectriclayers 314. The memory array 10 may be formed in some of the interlayerdielectric layers 314, such that the first signal lines SL1, the pillarstructures 112 and the second signal lines SL2 of the memory array 10are respectively surrounded by one of the interlayer dielectric layers314. The active devices 304 formed in the FEOL structure 300F lyingbelow the BEOL structure 300B may or may not be overlapped with thememory array 10 embedded in the BEOL structure 300B. Although the memoryarray 10 is depicted in FIG. 3A and FIG. 3B as being embedded in topmostthree interlayer dielectric layers 314, there may be actually more ofthe interlayer dielectric layers 314 stacked on the memory array 10, andthe memory array 10 may be distant from the topmost interlayerdielectric layer 314. In addition, the BEOL structure 300B also includesinterconnections 316 formed in the dielectric layers 314. Although onlypartially shown FIG. 3A and FIG. 3B, the interconnections 316 may spreadbelow, aside and above the memory array 10, and configured tointerconnect the active devices 304 and to out-rout the first and secondsignal lines SL1, SL2 of the memory array 10 to the active devices 304.As depicted in FIG. 3A and FIG. 3B, the interconnections 316 may includeconductive pads or lines respectively extending in one of the interlayerdielectric layers 314. Although not shown, the interconnections 316 mayalso include conductive vias respectively penetrating through one ormore of the interlayer dielectric layers 314 to establish electricalcontact with conductive pads or lines at different horizontal levels. Insome embodiments, the BEOL structure 300B further includes etching stoplayers 318 respectively lining between some adjacent ones of theinterlayer dielectric layers 314. For instance, as shown in FIG. 3A, anetching stop layer 318 may lie below the interlayer dielectric layer 314in which the first signal lines SL1 are formed, and the first signallines SL1 may penetrate through this etching stop layer 318 and extendto an underlying one of the interlayer dielectric layers 314.

Since the stacking structure ST in each pillar structure 112 islaterally surrounded by the carbon containing dielectric layer 122, thestacking structures ST in adjacent pillar structures 112 are separatedfrom each other with the carbon containing dielectric layers 122 ofthese adjacent pillar structures 112 in between. Hence, in addition to aportion of one of the interlayer dielectric layers 314 spanning betweenthe stacking structures ST in adjacent pillar structures 112, the carboncontaining dielectric layers 122 in these adjacent pillar structures 112also lie between these stacking structures ST. As a result of theultra-low dielectric constant of the carbon containing dielectric layers122, the parasitic capacitance between the stacking structures ST inadjacent pillar structures 122 can be reduced. In some embodiments, adielectric constant each interlayer dielectric layer 314 is greater thanthe dielectric constant of the carbon containing dielectric layers 122.For instance, the dielectric constant of each interlayer dielectriclayer 314 may range from about 3.0 to about 4.2, while the dielectricconstant of the carbon containing dielectric layer 122 may be less than2(as described with reference to FIG. 2A). As examples, the carboncontaining dielectric layers 122 may be formed of porous SiCOH, whereasthe interlayer dielectric layers 314 may be respectively formed ofsilicon oxide, the afore-mentioned low-k materials or the like.

Furthermore, the semiconductor chip 30 may also include electricalconnectors (not shown) formed on the BEOL structure 300B. The electricalconnectors may be electrically connected to the interconnections 316 ofthe BEOL structure 300B, and may be functioned as chip inputs/outputs(I/Os) of the semiconductor chip 30.

FIG. 4 is a flow diagram illustrating a method for forming the memoryarray 10 during manufacturing process of the semiconductor chip 30,according to some embodiments of the present disclosure. FIG. 5A throughFIG. 5L are schematic three-dimensional views illustrating intermediatestructures at various stages during formation of the memory array 10 asshown in FIG. 4.

Referring to FIG. 4 and FIG. 5A, step S100 is performed, and one of theinterlayer dielectric layers 314 (referred as an interlayer dielectriclayer 314 b hereinafter) is formed on another one of the interlayerdielectric layers 314 (referred as an interlayer dielectric layer 314 ahereinafter). As described with reference to FIG. 3A and FIG. 3B, theinterlayer dielectric layers 314 a, 314 b (i.e., two of the interlayerdielectric layers 314) are portions of the BEOL structure 300B stackedon the FEOL structure 300F. In some embodiments, an etching stop layer318 (referred as an etching stop layer 318 a hereinafter) is formed onthe interlayer dielectric layer 314 a before formation of the interlayerdielectric layer 314 b. The etching stop layer 318 a may have sufficientetching selectivity with respect to the interlayer dielectric layers 314a, 314 b. In some embodiments, the interlayer dielectric layers 314 a,314 b and the etching stop layer 318 a are respectively formed by adeposition process, such as a CVD process.

Referring to FIG. 4 and FIG. 5B, step S102 is performed, and trenches TRare formed in the interlayer dielectric layer 314 b. The trenches TRpenetrate through the interlayer dielectric layer 314 b, and separatelyextend along the direction Y in the interlayer dielectric layer 314 b.In those embodiments where the etching stop layer 318 a is disposedbetween the interlayer dielectric layers 314 a, 314 b, the trenches TRmay further penetrate through the etching stop layer 318 a. A method forforming the trenches TR may include a lithography process and at leastone etching process (e.g., an anisotropic etching process).

Referring to FIG. 4 and FIG. 5C, step 5104 is performed, and the firstsignal lines SL1 are formed in the trenches TR. The trenches TR may befilled up by the signal lines SL1. In some embodiments, a method forforming the first signal lines SL1 includes providing a conductivematerial on the structure shown in FIG. 5B by a deposition process, aplating process or a combination thereof. Subsequently, portions of theconductive material above a top surface of the interlayer dielectriclayer 314 a is removed by a planarization process, and the remainedportions of the conductive material in the trenches TR form the firstsignal lines SL1. For instance, the planarization process may include apolishing process, an etching process (e.g., an isotropic etchingprocess) or a combination thereof.

Referring to FIG. 4 and FIG. 5D, step 5106 is performed, and aresistance variable material layer 500, an electrode material layer 502,an adhesive material layer 504 and a switching material layer 506 areformed on the current structure. The resistance variable material layer500, the electrode material layer 502, the adhesive material layer 504and the switching material layer 506 will be patterned to form theresistance variable layer 114, the electrode layer 116 the adhesivelayer 117 and the switching layer 118 as described with reference toFIG. 2A, respectively. Currently, the resistance variable material layer500, the electrode material layer 502, the adhesive material layer 504and the switching material layer 506 globally cover the interlayerdielectric layer 314 b and the first signal lines SL1. In someembodiments, the resistance variable material layer 500, the electrodematerial layer 502, the adhesive material layer 504 and the switchingmaterial layer 506 are respectively formed by a deposition process, suchas a CVD process, a physical vapor deposition (PVD) process or an atomiclayer deposition (ALD) process.

Referring to FIG. 4 and FIG. 5E, step 5108 is performed, and maskpatterns 508 are formed on stacking layers including the resistancevariable material layer 500, the electrode material layer 502, theadhesive material layer 504 and the switching material layer 506. Themask patterns 508 will be functioned as shadow masks during patterningof these stacking layers in the following step. In other words,positions of the mask patterns 508 determine positions of thesesubsequently formed patterns, and the mask patterns 508 are formed inshapes of the patterns expected to be obtained. For instance, the maskpatterns 508 are formed in pillar shapes. In some embodiments, the maskpatterns 508 are photoresist patterns, and are formed by a lithographyprocess.

Referring to FIG. 4 and FIG. 5F, step 5110 is performed, and theresistance variable material layer 500, the electrode material layer502, the adhesive material layer 504 and the switching material layer506 are patterned to form the stacking structures ST as described withreference to FIG. 2A. The resistance variable layer 114, the electrodelayer 116, the adhesive layer 117 and the switching layer 118 in eachstacking structure ST are a portion of the resistance variable materiallayer 500, a portion of the electrode material layer 502, a portion ofthe adhesive material 504 and a portion of the switching material layer506, respectively. As described above, the mask patterns 508 arefunctioned as shadow mask in the current patterning step. Portions ofthe stacking layers not covered by the mask patterns 508 are removed byan etching process (e.g., an anisotropic etching process) performed inan etching apparatus. For instance, the etching apparatus may be aninductive coupling plasma (ICP) etching apparatus or a transformercoupling plasma (TCP) etching apparatus. On the other hand, portions ofthe stacking layers covered by the mask patterns 508 remain, and formthe stacking structures ST. After formation of the stacking structuresST, the mask patterns 508 may be removed by a stripping process, anashing process or the like.

Referring to FIG. 4 and FIG. 5G, step S112 is performed, and a plasmacleaning process is performed on the current structure. In someembodiments, the plasma cleaning process is performed in the etchingapparatus used for the previous patterning step as described withreference to FIG. 5F. Further, in some embodiments, a mixture of N₂plasma and Ar plasma is generated in the etching apparatus forperforming the plasma cleaning process. In these embodiments, thecurrent structure may be subjected to nitridation from exposed surfaces,and a nitride layer 510 may be formed in a surface region of the currentstructure. The nitride layer 510 may be further patterned to form thenitride layers 124 each described with reference to FIG. 2A. Sinceexposed components in the current structure may have differentsusceptibilities to nitridation, a thickness of the nitride layer 510may vary among different components in the current structure. Inalternative embodiments, a mixture of H₂ plasma and Ar plasma isgenerated in the etching apparatus for performing the plasma cleaningprocess. In these alternative embodiments, the current structure may notbe subjected to nitridation, and the nitride layer 510 may be absent.

Referring to FIG. 4 and FIG. 5H, step 5114 is performed, and a carboncontaining dielectric layer 512 is globally formed on the currentstructure. The carbon containing dielectric layer 512 will be patternedto form the carbon containing dielectric layers 122 each described withreference to FIG. 2A. Currently, the carbon containing dielectric layer512 may conformally cover the stacking structures ST, the interlayerdielectric layer 314 b and the first signal lines SL1. In thoseembodiments where the nitride layer 510 is previously formed, thenitride layer 510 may be entirely covered by the carbon containingdielectric layer 512. The carbon containing dielectric layer 512 may beformed by a deposition process performed in the etching apparatus usedfor previous patterning step as described with reference to FIG. 5F. Byperforming the deposition in the etching apparatus, the deposited carboncontaining dielectric layer 512 may be amorphous and have high porosity,due to low film density. As a result the high porosity, the carboncontaining dielectric layer 512 may have an ultra low dielectricconstant. During the deposition of the carbon containing dielectriclayer 512, a hydrocarbon source gas is provided to the etchingapparatus, and is ionized then deposited onto a workpiece (e.g., thestructure as shown in FIG. 5G) to form the carbon containing dielectriclayer 512. In some embodiments, the hydrocarbon source gas includesmethane (CH₄), ethyne (C₂H₂), ethene (C₂H₄), the like or combinationsthereof.

Referring to FIG. 4 and FIG. 5I, step S116 is performed, and portions ofthe carbon containing dielectric layer 512 extending along top surfacesof the stacking structures ST, the interlayer dielectric layer 314 b andthe firs signal lines SL1 are removed. Remained portions of the carboncontaining dielectric layer 512 on sidewalls of the stacking structuresST form the carbon containing dielectric layers 122. In thoseembodiments where the nitride layer 510 is formed before formation ofthe carbon containing dielectric layer 512, portions of the nitridelayer 510 extending along the top surfaces of the stacking structuresST, the interlayer dielectric layer 314 b and the firs signal lines SL1may be removed as well. Remained portions of the nitride layer 510extending along the sidewalls of the stacking structures ST form thenitride layers 124. The stacking structures ST along with the carboncontaining dielectric layers 122 (and the nitride layers 124) form thepillar structures 112. In addition, the top surfaces of the interlayerdielectric layer 314 b and the first signal lines SL1 around the pillarstructures 112 may be currently exposed. In some embodiments, a methodfor patterning the carbon containing dielectric layer 512 (and thenitride layer 510) includes an etching process, such as an anisotropicetching process.

Referring to FIG. 4 and FIG. 5J, step S118 is performed, and another oneof the interlayer dielectric layers 314 (referred as an interlayerdielectric layer 314 c hereinafter) is formed around the pillarstructures 112. The pillar structures 112 are laterally surrounded bythe interlayer dielectric layer 314 c, and the previously exposed topsurfaces of the interlayer dielectric layer 314 b and the first signallines SL1 are covered by the interlayer dielectric layer 314 c. In someembodiments, top surfaces of the pillar structures 112 are substantiallycoplanar with a top surface of the interlayer dielectric layer 314 c. Amethod for forming the interlayer dielectric layer 314 c may includeproviding a dielectric material on the structure shown in FIG. SI by adeposition process, such as a CVD process. Subsequently, portions of thedielectric material above the top surfaces of the pillar structures 112are removed by a planarization process, and remained portions of thedielectric material form the interlayer dielectric layer 314 c. Forinstance, the planarization process may include a polishing process, anetching process (e.g., an isotropic etching process) or a combinationthereof.

Referring to FIG. 4 and FIG. 5K, step 5120 is performed, and the secondsignal lines SL2 are formed on the current structure. The second signallines SL2 may extend along the direction X on the interlayer dielectriclayer 314 c, and each electrically connect to a row of the pillarstructures 112. In some embodiments, a method for forming the secondsignal lines SL2 includes globally forming a conductive layer on thestructure as shown in FIG. 5J by a deposition process, a plating processor a combination thereof. Thereafter, the conductive layer is patternedto form the second signal lines SL2 by a lithography process and atleast one etching process. In these embodiments, the top surfaces of thepillar structures 112 can remain covered, thus can be prevented frombeing damaged by an etching process.

Referring to FIG. 4 and FIG. 5L, step 5122 is performed, and anadditional one of the interlayer dielectric layers 314 (referred as aninterlayer dielectric layer 314 d hereinafter) is formed around thesecond signal lines SL2. The second signal lines SL2 may be laterallysurrounded by the interlayer dielectric layer 314 d. In someembodiments, a top surface of the interlayer dielectric layer 314 d issubstantially coplanar with top surfaces of the second signal lines SL2.A method for forming the interlayer dielectric layer 314 d may includeglobally providing a dielectric material on the structure as shown inFIG. 5K by a deposition process, such as a CVD process. Subsequently,portions of the dielectric material above the top surfaces of the secondsignal lines SL2 are removed by a planarization process, and remainedportions of the dielectric layer form the interlayer dielectric layer314 d. For instance, the planarization process may include a polishingprocess, an etching process or a combination thereof. Since the topsurfaces of the pillar structures 112 remain covered by the secondsignal lines SL2, possible damages on the top surfaces of the pillarstructures 112 during formation of the interlayer dielectric layer 314 dmay be avoided.

Up to here, the memory array 10 as described with reference to FIG. 1A,FIG. 1B, FIG. 2A and FIG. 2B has been formed in a stack of interlayerdielectric layer 314 (i.e., the interlayer dielectric layers 314 a-314d). Further BEOL process as well as packaging process may be performedon the current structure, for completing manufacturing of asemiconductor chip.

FIG. 6A is a schematic three-dimensional view illustrating a memoryarray 10 a according to some embodiments of the present disclosure. FIG.6B is a schematic cross-sectional view of one of the memory cells 100′as shown in FIG. 6A.

The memory array 10 as shown in FIG. 1A includes the memory cells 100 ata single horizontal level and connected to vertically separated firstand second signal lines SL1, SL2. On the other hand, the memory array 10a as shown in FIG. 6A has multiple horizontal levels. As shown in FIG.6A, layers each having an array of the memory cells 100 and layers eachhaving an array of memory cells 100′ may be alternately stacked along avertical direction. In some embodiments, the memory cells 100 in a layerare substantially aligned with the memory cells 100′ in an adjacentlayer. In addition to the memory cells 100, 100′, layers of the firstsignal lines SL1 and layers of the second signal lines SL2 may bealternately stacked along the vertical direction as well. Each layer ofthe memory cells 100 are defined between an underlying layer of thefirst signal lines SL1 and an overlying layer of the second signal linesSL2. On the other hand, each layer of the memory cells 100′ are definedbetween an underlying layer of the second signal lines SL2 and anoverlying layer of the first signal lines SL1. Further, the layers ofthe first and second signal lines SL1, SL2 located between the layers ofthe memory cells 100, 100′ are shared by the memory cells 100, 100′.

The memory cells 100′ are similar to the memory cells 100, except that astacking order of layers in each memory cell 100′ may be opposite to astacking order of layers in each memory cell 100. As described withreference to FIG. 2A, the resistance variable layer 114, the electrodelayer 116, the adhesive layer 117 (optional) and the switching layer 118in each memory cell 100 are sequentially stacked from a top side of afirst signal line SL1 to a bottom side of a second signal line SL2. Onthe other hand, as shown in FIG. 6B, the switching layer 118, theadhesive layer 117 (optional), the electrode layer 116 and theresistance variable layer 114 may be sequentially stacked from a topside of a second signal line SL2 to a bottom side of a first signal lineSL1. A resistance variable element 110′ in the memory cell 100′, whichis similar to the resistance variable element 110 in the memory cell 100as described with reference to FIG. 1B and FIG. 2A, is defined by thefirst signal line SL1, the resistance variable layer 114, the electrodelayer 116 and the adhesive layer 117 (optional). In addition, a selector120′ in the memory cell 100′, which is similar to the selector 120 inthe memory cell as described with reference to FIG.

1B and FIG. 2A, is defined by the second signal line SL2, the switchinglayer 118, the adhesive layer 117 (optional) and the electrode layer116, and is connected to the resistance variable element 110′ from belowthe resistance variable element 110′.

Referring to FIG. 6A, in some embodiments, end portions of the firstsignal lines SL1 in an upper layer are laterally protruded from endportions of the first signal lines SL1 in a lower layer, such that thefirst signal lines SL1 in the upper layer have end portions EP1 notoverlapped with the first signal lines SL1 in the lower layer. In thisway, the first signal lines SL1 in the upper layer can be out-routedfrom these end portions EP1, and each layer of the first signal linesSL1 can be independently controlled. Similarly, end portions of thesecond signal lines SL2 in an upper layer may be laterally protrudedfrom end portions of the second signal lines SL2 in a lower layer, suchthat the second signal lines SL2 in the upper layer may have endportions EP2 not overlapped with the second signal lines SL2 in thelower layer. In this way, the second signal lines SL2 in the upper layercan be out-routed from these end portions EP2, and each layer of thesecond signal lines SL2 can be independently controlled.

As similar to the memory array 10 as described with reference to FIG.1A, FIG. 3A and

FIG. 3B, the memory array 10 a as shown in FIG. 6A may be embedded in aBEOL structure of a semiconductor chip as well, and may be routed toactive devices in a FEOL structure lying below the BEOL structure in thesemiconductor chip.

As being deployed along the vertical direction, the memory array 10 a isno longer limited to two-dimensional design, and storage density can besignificantly increased without increasing a footprint area of thememory array 10 a. Each horizontal level of the memory array 10 a may bedefined by a layer of the memory cells 100/100′ and the layers of thefirst and second signal lines SL1, SL2 connected thereto. Although thememory array 10 a is depicted as having four horizontal levels, thoseskilled in the art may adjust an amount of the horizontal levels of thememory array 10 a. For instance, the memory cell 10 a may have two toten horizontal levels.

FIG. 7 is a block diagram illustrating an arrangement of a memory array70 a and a driving circuit 70 b lying below the memory array 70 a,according to some embodiments of the present disclosure.

Referring to FIG. 7, the memory array 70 a may be the memory array 10 asdescribed with reference to FIG. 1A, or the memory array 10 a asdescribed with reference to FIG. 6A. The memory array 70 a lies abovethe driving circuit 70 b in a semiconductor chip. As similar to thememory array 10 as described with reference to FIG. 3A and FIG. 3B, thememory array 70 a may be embedded in a BEOL structure. On the otherhand, active devices of the driving circuit 70 b may be formed in a FEOLstructure lying below the BEOL structure, as also described withreference to FIG. 3A and FIG. 3B. Since the memory array 70 a can beformed over the FEOL structure, design of the active devices in alreadycrowded FEOL structure may be less limited. Alternatively, more activedevices may be integrated in the FEOL structure.

The driving circuit 70 is coupled to the memory array 70 a, andconfigured to drive the memory array 70 a. In some embodiments, thedriving circuit 70 includes write drivers 700, read drivers 702 andcolumn decoders 704. In some embodiments, the write drivers 700, theread drivers 702 and the column decoders 704 are arranged as an array.The write drivers 700 may each coupled with one to eight word lines, andmay be configured to facilitate a write operation. The read drivers 700,such as sense amplifiers, may each coupled with one to 8 bit lines, andmay be configured to facilitate a read operation. The word lines may bethe second signal lines SL2, and the bit lines may be the first signallines SL1. Alternatively, the word lines may be the first signal linesSL1, while the bit lines may be the second signal lines SL2. The columndecoders 704 may be coupled to the write drivers 700 and the readdrivers 702, and may be configured to perform column selection.

In addition, the driving circuit 70 b further includes a row decoder 706and a word line driver 708. The row decoder 706 may be coupled with thecolumn decoders 704, and may be configured to perform row selection. Theword line driver 708 may be coupled with the word lines (i.e., the firstor second signal lines SL1/SL2), and configured to provide writecurrent/voltage to the word lines. In some embodiments, the writedrivers 700, the read drivers 702, the column decoders 704, the rowdecoder 706 and the word line driver 708 are overlapped with theoverlying memory array 70 a, and thus depicted by ghost lines. On theother hand, as to be further described, the driving circuit 70 b mayfurther include components located around the overlying memory array 70a.

In those embodiments where the memory array 70 a have multiplehorizontal levels of memory cells, the driving circuit 70 b may furtherinclude a layer selection circuit 710. The layer selection circuit 710may be configured to perform a layer selection, for determining whichhorizontal level of the memory array 70 a is subjected to a write/readoperation. Furthermore, the driving circuit 70 b may further include anerror correction circuit (ECC) 712, a charge pumping circuit 714 and atiming control circuit 716. The ECC 712 may be configured to performcorrection of errors in stored data stored. The charge pumping circuit714 may be configured to provide possibly required large current/voltagefor a write operation. Further, the timing control circuit 716 may beconfigured to sequence operations of multiple sub-arrays in the memoryarray 70 a. As mentioned above, the layer selection circuit 710, the ECC712, the charge pumping circuit 714 and the timing control circuit 716may be disposed within a region of the FEOL structure not overlappedwith the overlying memory array 70 a. In some embodiments, the layerselection circuit 710, the ECC 712, the charge pumping circuit 714 andthe timing control circuit 716 laterally surround a region of the FEOLstructure that is overlapped with the overlying memory array 70 a (e.g.,the region in which components including the write drivers 700, the readdrivers 702, the column decoders 704, the row decoder 706 and the wordline driver 708 are disposed).

However, those skilled in the art may modify the driving circuit 70 baccording to design requirements. The present disclosure is not limitedto the components and/or arrangement of the components in the drivingcircuit 70 b.

As above, the memory array according to embodiments of the presentdisclosure includes memory cells defined at intersections (or referredas cross-points) of signal lines running at different horizontal levels.The memory cells each include a pillar structure having functionallayers stacked along a vertical direction. These functional layers alongwith the overlying and underlying signal lines define a resistancevariable element and a selector connected to the resistance variableelement by a shared terminal. In addition, each memory cell furtherincludes a carbon containing dielectric layer laterally surrounding astacking structure of the functional layers. Thereby, the selector andthe resistance variable element in a memory cell can be spaced apartfrom the selector and the resistance variable element in an adjacentmemory cell with the carbon containing dielectric layers of these memorycells in between. The carbon containing dielectric layer has an ultralow dielectric constant, thus a parasitic capacitance between adjacentmemory cells can be effectively lowered. Accordingly, RC delay in thememory array can be reduced. Moreover, the carbon containing dielectriclayer may protect the stacking structure from damages caused by moistureand etchants during manufacturing of the memory array. Therefore, aqueue time during the manufacturing of the memory array can be lesslimited.

In an aspect of the present disclosure, a memory array is provided. Thememory array comprises: first signal lines, extending along a firstdirection; second signal lines, extending along a second direction overthe first signal lines; and memory cells, defined at intersections ofthe first and second signal lines, and respectively comprising: aresistance variable layer; a switching layer, overlapped with theresistance variable layer; an electrode layer, lying between theresistance variable layer and the switching layer; and a carboncontaining dielectric layer, laterally surrounding a stacking structurecomprising the resistance variable layer, the switching layer and theelectrode layer.

In another aspect of the present disclosure, a method for manufacturinga memory array is provided. The method comprises: forming first signallines in trenches of a first dielectric layer; forming stackingstructures on the first signal lines, wherein the stacking structuresare laterally separated from one another, and each of the stackingstructures comprises a resistance variable layer, a switching layer andan electrode layer lying between the resistance variable layer and theswitching layer; forming a carbon containing dielectric layer coveringexposed surfaces of the first dielectric layer, the first signal lines,and the stacking structures; removing portions of the carbon containingdielectric layer extending along a top surface of the first dielectriclayer, top surfaces of the first signal lines and top surfaces of thestacking structures; forming a second dielectric layer spanning betweenpillar structures each comprising one of the stacking structures and aremained portion of the carbon containing dielectric layer laterallysurrounding the one of the stacking structures; and forming secondsignal lines on the second dielectric layer and the pillar structures,wherein the pillar structures are located at intersections of the firstand second signal lines.

In yet another aspect of the present disclosure, a semiconductor chip isprovided. The semiconductor chip comprises: a substrate; active devices,formed at a surface of the substrate; a stack of dielectric layers,formed on the surface of the substrate, and covering the active devices;and a memory array, embedded in the dielectric layers, and comprising:first signal lines; second signal lines, running over and intersectedwith the first signal lines; and memory cells defined at intersectionsof the first and second signal lines, and respectively comprising apillar structure with a carbon containing dielectric layer defining asidewall of the pillar structure.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A memory array, comprising first signal lines,extending along a first direction; second signal lines, extending alonga second direction over the first signal lines; and memory cells,defined at intersections of the first and second signal lines, andrespectively comprising: a resistance variable layer; a switching layer,overlapped with the resistance variable layer; an electrode layer, lyingbetween the resistance variable layer and the switching layer; and acarbon containing dielectric layer, laterally surrounding a stackingstructure comprising the resistance variable layer, the switching layerand the electrode layer.
 2. The memory array according to claim 1,wherein a dielectric constant of the carbon containing dielectric layeris less than 2, and substantially equal to or greater than 1.5.
 3. Thememory array according to claim 1, further comprising a dielectric layerspanning between pillar structures each comprising the stackingstructure and the carbon containing dielectric layer in one of thememory cells, and a dielectric constant of the carbon containingdielectric layer in each memory cell is less than a dielectric constantof the dielectric layer.
 4. The memory array according to claim 1,wherein the carbon containing dielectric layer is porous.
 5. The memoryarray according to claim 1, wherein the carbon containing dielectriclayer is amorphous.
 6. The memory array according to claim 1, whereinthe carbon containing dielectric layer is formed of an oxide dielectricmaterial comprising Si, C, O and H.
 7. The memory array according toclaim 1, wherein the stacking structure of each memory cell has anitridation region laterally extending into the stacking structure froma sidewall of the stacking structure.
 8. The memory array according toclaim 1, wherein a resistance variable element in each memory cell isdefined by the electrode layer, the resistance variable layer and anunderlying one of the first signal lines, and a two-terminal selector ineach memory cell is defined by the electrode layer, the switching layerand an overlying one of the second signal lines.
 9. The memory arrayaccording to claim 1, wherein the stacking structure in each memory cellfurther comprises an adhesive layer lying between the electrode layerand the switching layer.
 10. The memory array according to claim 8,wherein the adhesive layer is formed of a conductive material.
 11. Amethod for manufacturing a memory array, comprising: forming firstsignal lines in trenches of a first dielectric layer; forming stackingstructures on the first signal lines, wherein the stacking structuresare laterally separated from one another, and each of the stackingstructures comprises a resistance variable layer, a switching layer andan electrode layer lying between the resistance variable layer and theswitching layer; forming a carbon containing dielectric layer coveringexposed surfaces of the first dielectric layer, the first signal lines,and the stacking structures; removing portions of the carbon containingdielectric layer extending along a top surface of the first dielectriclayer, top surfaces of the first signal lines and top surfaces of thestacking structures; forming a second dielectric layer spanning betweenpillar structures each comprising one of the stacking structures and aremained portion of the carbon containing dielectric layer laterallysurrounding the one of the stacking structures; and forming secondsignal lines on the second dielectric layer and the pillar structures,wherein the pillar structures are located at intersections of the firstand second signal lines.
 12. The method for manufacturing the memoryarray according to claim 11, wherein a method for forming the stackingstructures comprises: forming a resistance variable material layer, anelectrode material layer and a switching material layer on the firstdielectric layer and the first signal lines; forming mask patterns onstacking layers comprising the resistance variable material layer, theelectrode material layer and the switching material layer; performing anetching process, to remove portions of the stacking layers around themask patterns, wherein remained portions of the resistance variablematerial layer respectively form the resistance variable layer in eachstacking structure, remained portions of the electrode materialrespectively form the electrode layer in each stacking structure, andremained portions of the switching material respectively form theswitching layer in each stacking structure; and removing the maskpatterns.
 13. The method for manufacturing the memory array according toclaim 12, wherein formation of the carbon containing dielectric layer isperformed in an etching apparatus used for performing the etchingprocess.
 14. The method for manufacturing the memory array according toclaim 13, wherein a hydrocarbon source gas is provided into the etchingapparatus, then ionized and deposited on the exposed surfaces of thefirst dielectric layer, the first signal lines, and the stackingstructures during formation of the carbon containing dielectric layer.15. The method for manufacturing the memory array according to claim 12,further comprising performing a plasma cleaning process on the stackingstructures, the first dielectric layer and the first signal lines beforeformation of the carbon containing dielectric layer and after formationof the stacking structures.
 16. The method for manufacturing the memoryarray according to claim 15, wherein the plasma cleaning process isperformed in an etching apparatus for performing the etching process.17. The method for manufacturing the memory array according to claim 11,wherein a method for forming the second signal lines comprises: forminga conductive layer on the second dielectric layer and the pillarstructures; and removing portions of the conductive layer, such thatremained portions of the conductive layer form the second signal lines.18. A semiconductor chip, comprising: a substrate; active devices,formed at a surface of the substrate; a stack of dielectric layers,formed on the surface of the substrate, and covering the active devices;and a memory array, embedded in the dielectric layers, and comprising:first signal lines; second signal lines, running over and intersectedwith the first signal lines; and memory cells defined at intersectionsof the first and second signal lines, and respectively comprising apillar structure with a carbon containing dielectric layer defining asidewall of the pillar structure.
 19. The semiconductor chip accordingto claim 18, wherein a dielectric constant of the carbon containingdielectric layer in each memory cell is less than a dielectric constantof the dielectric layers.
 20. The semiconductor chip according to claim18, wherein at least a portion of the active devices are overlapped withthe memory array.